SiNESEMI has successively launched to the market a new generation of auto-grade package series, featuring industry-leading fused-lead pin design, stronger current-carrying capacity, and superior heat dissipation performance. This series includes PDFN5060-8L-W, STOLL 7x8, and TOLL 10x12, with a voltage range of 40V to 200V—all truly benchmarked against products from the world’s leading manufacturers. These standout features highlight the core advantages of the automotive-grade PDFN5060-8L-W package and further enhance its product competitiveness.
SiNESEMI recently launched auto-grade products with PDFN5060-8L-W package , featuring a Lead-fused pin design at the S-source and is equipped with Wettable Flanks. Compared with PDFN5060-8L, the contact area between the S-source and the PCB board has increased by nearly 70%, and the maximum package current capacity has risen from 100A to 120A, with an extreme capacity increase of 20%. This results in higher current density and better heat dissipation performance, making it more suitable for high-power EPS, I-booster and other chassis applications. The use of Wettable Flanks in the pins not only enhances the solderability but also facilitates the detection of AOI during PCB soldering of the device, further improving the reliability of the device at the board level, in line with the trend of automotive packaging requirements.
Beyond automotive applications, in some high-end power supply fields, products are developing toward the trend of smaller size and higher power density. It is often necessary to ensure the stability of power supply under various complex environments such as extreme temperature conditions and strong shock and vibration. This undoubtedly places extremely strict requirements on the reliability and current-carrying capacity of MOSFET products, and automotive-grade MOSFET products are often required for such occasions.
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